Held at the Hot Chips conference in Cupertino 28, traditionally held at Stanford University, allowed to learn more about the advanced chips of NVIDIA and Microsoft.NVIDIA Drive PX the NVIDIA 2Компания, early last year introduced a version of the first...
2016-08-29 06:53:01 301
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Held at the Hot Chips conference in Cupertino 28, traditionally held at Stanford University, allowed to learn more about the advanced chips of NVIDIA and Microsoft.
NVIDIA, at the beginning of last year, introduced a version of the first generation car platform DRIVE PX for automatic control of movement of the machine.
the mini-computer at that time, was the microprocessor, the Tegra X1, with a value performance of 2.3 TFlops. At CES 2016, was announced Drive PX of the second generation, where performance is measured in the area of 8 TFlops, which is quite passable for gaming platform.
It consists of a bunch of two SoC Parker, with three cores and one GPU, based on Pascal architecture.
Two cores have the name Denver 2.0, the other four less powerful Cortex-A57. In the role of the graphics accelerator is used with 256 CUDA-cores. According to NVIDIA, the performance of their system by 100% more than most powerful mobile processor.
it is Said that so much power will be needed for virtual reality, artificial intelligence and systems prevent unsafe travel. Parker controls about 8 virtual machines, allowing you to take the Board several systems in the same vehicle.
Technical specifications Drive PX 2:
2 MB + 2 MB L2 cache, architecture Coherent HMP
DX12, OpenGL 4.5 and 8.8 NVIDIA CUDA, OpenGL ES 3.1, AEP and Vulkan
decoder: H. 265, VP9 4K 60 FPS
More than 80 manufacturers agreed to use in their cars. Next year, Volvo will take on beta PX2 Drive in its XC90 SUV.
Also on show Microsoft revealed details about HPU (Holographic Processing Unit) – holographic processor of the helmet augmented reality HoloLens. Designed chip for 28 nm fabrication processor, the Taiwanese concern-manufacturer TSMC. SoC has 24 cores, Tensilica DSP, 8 GB RAM SRAM and 1 GB LPDDR3, processing up to a trillion operations per second.
the Chip easily fits in the so-called body, BGA, virtual reality helmet, with a maximum available area of dimensions 12×12 mm. the Level is a large energy consumption 10 watts.
Note that AR HoloLens helmet available at a price of $3000 for developers and commercial use Microsoft HoloLens Commercial Suite, including, also, program security device management.